- Laser annealing system
- Molding machine
- Compression Molding Machine SY-COMP
- Transfer Molding Machine
- Visual Mold Analysis System
- Mold Die
- Precision Positioning machine XY Stage
- Motion controller
- Servo driver
- Linear motor
- Air actuator
Top >> Products >> Products for Semi./LED processing >> Molding machine >> Compression Molding Machine SY-COMP
Feature
Long Wire Package Avalable
- Molding for Large Size Substrate
Mazimum(W)85×(L)295mm
- double the width comparedto conventional area - Presses with High Accuracy
Press parallel degree ±0.025mm secured - High Productivity
Quadruple productivity with multi-press modules for large size substrates (Internal comparison) - Detection for Die Chips
Added die chip detection for accurate molding of layared MCP.
Specification
| Press | Method | Lower Clamp Method |
|---|---|---|
| Clamping Force | 147kN (15tonf) | |
| Capacity | 1cav. / shot max 190 x 60mm | |
| Macine Time | 40 sec | |
| Resin | Compound | |
| Power Utility | AC200(V)±10% 60(A:Max) | |
| Pneumatics 0.50MPa(4.5kgf/cm3) | ||
| Dimention | 1800(W) x 1140(D) x 1755(H) | |
| Weight | 2,500KG | |
Sumitomo Heavy Industries, Ltd. Sales Department Group 1, Mechatronics Division
