Compression Molding Machine SY-COMP

Long Wire Package Avalable

• Molding for Large Size Substrate
  Mazimum(W)85×(L)295mm
  - double the width comparedto conventional area
• Presses with High Accuracy
  Press parallel degree ±0.025mm secured
• High Productivity
  Quadruple productivity with multi-press modules for l arge size substrates (Internal comparison)
• Detection for Die Chips
  Added die chip detection for accurate molding of layared MCP.

Transfer Molding Machine

Variety of Auto Molding Machinen Line up

• SY-SX120
• SY-FX80
• SY-50X
• SY-C60
• SY-H80

Visual Mold Analysis System

Visual Mold Analysis Achievement

• Relationship of Resin Viscosity v.s. Flow Pattern
• Relationship of Gate Design v.s. Flow Pattern
• Cause of Incomplete Filling
• Relationship of Jetting v.s. Lead Frame Design
• Relationship of Wire Existence v.s. Flow Pattern
• Relationship of Air Containing in the Pot v.s. Void

Mold Die

We provide QFP,TSOP,BGA,FCBGA,etc LSI Packages' Mold Die.